LOW MELTING POINT SOLDERING AID REMOVE BGA ICS EASILY 1X CHIPFLOW SOLDER STICK

1X CHIPFLOW SOLDER STICK (LOW MELTING POINT SOLDERING AID) REMOVE BGA ICS EASILY. Ideal for BGA and SMD chip removal. the solder is supplied in lengths of 12cm dia is 1mm. the solder is Reusable.. Condition:: New: A brand-new, unused, unopened and undamaged item in original retail packaging (where packaging is applicable). If the item comes direct from a manufacturer, it may be delivered in non-retail packaging, such as a plain or unprinted box or plastic bag. See the seller's listing for full details. See all condition definitions : brand: : Apple , MPN: : Does not apply: model: : Apple , Compatible Model: : Iphone X: Type: : Tool , Compatible Brand: : Unbranded: EAN: : Does not apply , 。

LOW MELTING POINT SOLDERING AID REMOVE BGA ICS EASILY 1X CHIPFLOW SOLDER STICK
LOW MELTING POINT SOLDERING AID REMOVE BGA ICS EASILY 1X CHIPFLOW SOLDER STICK
LOW MELTING POINT SOLDERING AID REMOVE BGA ICS EASILY 1X CHIPFLOW SOLDER STICK
LOW MELTING POINT SOLDERING AID REMOVE BGA ICS EASILY 1X CHIPFLOW SOLDER STICK
LOW MELTING POINT SOLDERING AID REMOVE BGA ICS EASILY 1X CHIPFLOW SOLDER STICK